TEST : ANALYSIS DIVISION

이미지 추출

• Delayer1 ~28nm
• Echingremoving protection layer, oxide layer,
  passivation layer, metal layer ,etc 가능
• dyeing technologiesSingle Well dyeing, Deep Well dyeing and ROM
  code point dyeing.
• De-process chipsAl, Au, and Cu
• Analyze chipsBCD, SOL, GaAs, and SiGe