Structural analysis, defect phenomenon, and cause are checked through the cross section of the area you want to check, such as element, PCM, SMT, etc.
It is mainly used to check the exact structure and defect in the peeling phenomenon and bonding area identified in the non-destructive analysis through X-Ray, SAT analysis.
It is easy to check internal cracks, peeling phenomenon, void, and other defects that do not come from outside.