ADVANCED ANALYSIS / TEST

TC

    TC (Temperature Cycle)

    • Semiconductor devices & packages, which are composed of different materials, have different number of thermal expansion, so defects due to thermal changes are accelerated. It is a test to evaluate the adaptability to environmental changes at such sudden temperatures.
    • Semiconductor devices are made up of different materials, each of which has a different number of thermal expansion, which accelerates the defect caused by thermal changes.

    Conditions of progress

    Spec Step Test condition
    A B C D E F G H K
    MIL-STD-883 Cold -55
    (-10/+0)    		 -55
    (-10/+0)    		 -65
    (-10/+0)    		 -65
    (-10/+0)    		 -65
    (-10/+0)    		 -65
    (-10/+0)
    Hot 85
    (+10/-0)    		 125
    (+10/-0)    		 150
    (+10/-0)    		 200
    (+10/-0)    		 300
    (+10/-0)    		 175
    (+10/-0)
    JESD22-A104 Cold -55
    (-10/+0)    		 -55
    (-10/+0)    		 -65
    (-10/+0)    		 -40
    (-10/+0)    		 -55
    (-10/+0)    		 -0
    (-10/+0)
    Hot 85
    (+10/-0)    		 125
    (+10/-0)    		 150
    (+10/-0)    		 125
    (+10/-0)    		 150
    (+10/-0)    		 125
    (+10/-0)
    Condition Reference Test requirements/cautions
    AEC-Q100 JEDEC JESD22-A104 and Appendix 3 Proceed with WBP after TC (After TC completion, perform WBP using 5 samples in one lot: 2 intermediate bonds per corner and 1 intermediate bond per side)
    Grade 0 : -55ºC to +150ºC for 2000 cycles or equivalent.
    Grade 1 : -55°C to +150oC for 1000 cycles or equivalent. (Note: -65°C to 150°C for 500 cycles is also an allowed test condition due to legacy use with no known lifetime issues. )
    Grade 2 : -55ºC to +125ºC for 1000 cycles or equivalent.
    Grade 3 : -55ºC to +125ºC for 500 cycles or equivalent.