ADVANCED ANALYSIS / TEST

THB

    THB (Temperature Humidity Storage bias)

    • It is a test applied to plastic package products to evaluate the reliability of the package process of semiconductor devices by accelerating moisture penetration by maintaining high temperature and high humidity. Moisture penetration through pores in the Micro Gap or Molding Compound between Lead and Lead causes corrosion of Pad Metal or Passivation Crack by moisture and debris, and corrosion of metal wiring membranes on chip surfaces and other defects.
    • In humid environments, the reliability of sealed IC devices is accelerated by temperature, humidity and bias conditions, either through the outer protective material or through the interface between the outer protective material and the metal conductor passing through it.

    Conditions of progress

    Spec Test condition
    Temperature(℃) Humidity (%) Bias (V) Duration (Hrs)
    JESD22-A101 85℃ / ±2 85% / ±2 VCC Max 1000
    Condition Reference Test requirements/cautions
    AEC-Q100 JEDEC JESD22-A101 or A110 85℃/85%RH for 1000 hours or HAST (130℃/85%RH for 96 hours, or 110℃/85%RH for 264 hours).