ADVANCED ANALYSIS / TEST

Decapsulation

    Decapsulation

    • Perform complete removal of Epoxy (synthetic resin) that protects semiconductor ICs
    • Electronic devices/parts are enclosed in epoxy mold compound (EMC) for internal IC protection.
    • The process of removing EMC for visual observation of ICs, wires, leads, etc. is called Decapsulation (De-cap).
    • It is divided into a partial removal hole de-cap and a full-de-cap that removes the entire EMC. In the case of a hole de-cap, it is easy to conduct electrical analysis (Curve, Emission, etc.)/Wire Pull Test. In the case of a Full-Decap, only IC is extracted, so it is easy to perform De-layer, Re-Bonding Test.

    Apply Analysis

    • Surface observation
    • Pre-sample treatment
      FE-SEM
      FIB
      EMMI
      Pull Test
    • Image extraction

    Analysis Examples