ADVANCED ANALYSIS / TEST

Delayer

    Delayer (Plasma Etching, Mechanical & Chemical)

    • It is an analysis of layer observation by removing metal and oxide films of each layer of semiconductor IC.
    • Extract circuit images and check for defects by removing layers
    • Remove layers using Wet Etch, Dry Etch, Polishing using physical techniques, etc

    Apply Analysis

    • Inspection by layer of expected defective position
    • Image Extraction Layer
      Image extraction

    Analysis Examples

    • Image Extraction –Layer Image extraction
    • Poly Contact Spike
    • Poly Punch Through
    • Metal Melting