라온솔루션

Solder Ball Bridge
Cu Pattern Melting
Wire Short
Wire Melting

(Scanning Acoustic Tomography)

C-san
T-san
Chip Crack
Delamination

(Scanning Electron Micro-scope & Energy Dispersive X-ray Spectro-scope)

Gold Bump Size Measurement
Whisker
GOX Breakdown
Contact Spike


(Photon Emission Micro-scope & Thermal Emission Micro-scope)

Emission
Probe Card Emission
BGA Package Emission
Back Side Emission