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Test Analysis Division

TEST ANALYSIS DIVISION

De-layering

Semiconductors consist of several layers of metal and oxide. For analyze structure inside the semiconductor, De-layering is performed to remove each layer one by one. Since chip defects exist on the surface or under layer, the work should be observed while removing each layer by layer. Each layer can be removed by Wet Etch using chemical or DRY Etch using gas, and RIE (Reactive Ion Etching) is used for dry etching.

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