TEST ANALYSIS DIVISION
Electronic components are surrounded by synthetic encapsulant called an epoxy molding compound (EMC) to protect the internal chip. The process of removing the synthetic encapsulant to observe the internal chip, gold wire, and lead frame is called Decapsulation. Decapsulation is divided into Hole Decapsulation, which selectively removes a part of EMC, and Full Decapsulation, which removes all EMC. In case of Hole Decapsulation, it is a process to remove EMC without Damage to internal Wire and Bonding Pad, so it has the advantage of additional electrical measurement. In addrition, Decapsulation is also available for glass materials, special resin and metal materials.