TEST ANALYSIS DIVISION
Moisture Sensitivity Level Test
If package types are different, The degree and influence of moisture penetration are different. Thick through-hole packages tend to have a slower absorption of moisture than thin SMD package. Problem arise because moisture permeate and remains in the package, Suddenly, when exposed to high temperature, water is expanded and a large stress is generated inside the package, which causes package crack due to popcorn phenomenon.
|2||30 ℃/60%||168hrs||1 year|
|6||30 ℃/60%||6hrs||time on label|
|MSL Preconditioning Must be performed prior to: THB, HAST,TC, AC, & UHAST||JESD22-A113||PC||Per appropriate MSL level per J-STD-020|