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Test Analysis Division

TEST ANALYSIS DIVISION

Moisture Sensitivity Level Test

If package types are different, The degree and influence of moisture penetration are different. Thick through-hole packages tend to have a slower absorption of moisture than thin SMD package. Problem arise because moisture permeate and remains in the package, Suddenly, when exposed to high temperature, water is expanded and a large stress is generated inside the package, which causes package crack due to popcorn phenomenon.

Reference Documents

Level Condition Time Floor life
1 85 ℃/85% 168hrs unlimited
2 30 ℃/60% 168hrs 1 year
2a 30 ℃/60% 696hrs 4weeks
3 30 ℃/60% 192hrs 168hrs
4 30 ℃/60% 96hrs 72hrs
5 30 ℃/60% 72hrs 48hrs
5a 30 ℃/60% 48hrs 24hrs
6 30 ℃/60% 6hrs time on label
Stress Ref. Abbv. Conditions
MSL Preconditioning Must be performed prior to: THB, HAST,TC, AC, & UHAST JESD22-A113 PC Per appropriate MSL level per J-STD-020

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