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Test Analysis Division

TEST ANALYSIS DIVISION

Image extraction

  • Delayer14~28nm
  • Eching removing protection layer, oxide layer,
    passivation layer, metal layer ,etc 가능
  • dyeing technologies Single Well dyeing, Deep Well dyeing and ROM
    code point dyeing.
  • De-process chips Al, Au, and Cu
  • Analyze chips BCD, SOL, GaAs, and SiGe

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